焊接和表面贴装技术 SCIE

期刊简介预计审稿时间： 12周，或约稿

Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.

The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.

《焊接与表面贴装技术》致力于为这一重要领域的技术知识和专业知识体系的研究和应用进步做出重要贡献。《焊接与表面贴装技术》是其姊妹刊物《电路世界》和《微电子国际》的补充。

该期刊涵盖了 SMT 的各个方面，从合金、焊膏和助焊剂到可靠性和环境影响，目前为无铅焊料和工艺的新知识提供了重要的传播途径。该期刊包括一项多学科研究，研究用于组装最先进的功能电子设备的关键材料和技术。重点是通过焊接组装设备和互连组件，同时也涵盖了广泛的相关方法。

《Soldering & Surface Mount Technology》(焊接和表面贴装技术)编辑部通讯方式为EMERALD GROUP PUBLISHING LIMITED, HOWARD HOUSE, WAGON LANE, BINGLEY, ENGLAND, W YORKSHIRE, BD16 1WA。如果您需要协助投稿或润稿服务，您可以咨询我们的客服老师。我们专注于期刊投稿服务十年，熟悉发表政策，可为您提供一对一投稿指导，避免您在投稿时频繁碰壁，节省您的宝贵时间，有效提升发表机率，确保SCI检索（检索不了全额退款）。我们视信誉为生命，多方面确保文章安全保密，在任何情况下都不会泄露您的个人信息或稿件内容。