半导体加工中的材料科学 SCIE

期刊简介预计审稿时间： 约1.7个月 约3.7周

Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.

Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.

Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.

《半导体加工中的材料科学》为讨论（光）电子、传感器、探测器、生物技术和绿色能源的功能材料和器件的新型加工、应用和理论研究提供了一个独特的论坛。

每期都旨在提供当前见解、新成就、突破和未来趋势的快照，涉及微电子、能量转换和存储、通信、生物技术、（光）催化、纳米和薄膜技术、混合和复合材料、化学加工、气相沉积、器件制造和建模等不同领域，这些领域是先进半导体加工和应用的支柱。

内容包括：亚微米器件的先进光刻技术；蚀刻及相关主题；离子注入；损伤演变和相关问题；等离子体和热 CVD；快速热处理；先进的金属化和互连方案；薄介电层、氧化；溶胶-凝胶处理；化学浴和（电）化学沉积；复合半导体加工；新型非氧化物材料及其应用； (大)分子和混合材料；分子动力学、从头算方法、蒙特卡罗等；分立电路和集成电路的新材料和新工艺；磁性材料和自旋电子学；异质结构和量子器件；半导体电学和光学特性的工程；晶体生长机制；可靠性、缺陷密度、固有杂质和缺陷。

《Materials Science In Semiconductor Processing》(半导体加工中的材料科学)编辑部通讯方式为ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OXON, OX5 1GB。如果您需要协助投稿或润稿服务，您可以咨询我们的客服老师。我们专注于期刊投稿服务十年，熟悉发表政策，可为您提供一对一投稿指导，避免您在投稿时频繁碰壁，节省您的宝贵时间，有效提升发表机率，确保SCI检索（检索不了全额退款）。我们视信誉为生命，多方面确保文章安全保密，在任何情况下都不会泄露您的个人信息或稿件内容。